For larger joints in wooden substrates, through which the material could trickle away, a diffusion-open trickle protection (e.g. MEHAFIPP) must be laid (no foil, otherwise there is a risk of condensation water damage!)
After stripping and compacting, and before applying the covering, the fill should be checked for evenness by means of a straight edge and spirit level. Unevenness is to be levelled out, edge zones may have to be re-spread.
When the fill is installed in areas where greater, and in particular dynamic loads are to be expected, sufficient pressure distribution must be provided (by means of load distribution plate) to ensure that the installed fill is compressed evenly.
Chip/OSB boards with tongue and groove are to be installed in a thickness of 18/19 mm, ideally 22 mm, staggered and glued all round; for pouring heights from 100 mm in 25 mm thickness or double-layer (staggered).
Even in the case of cement-fibre boards with a step fold, the fill must be covered with a load distribution plate. Otherwise, the installation guidelines of the individual manufacturers must be observed. The same applies to standards and recognised rules of technology.