Important installation instructions

MEHA fills must be transported and stored in the original packaging and protected from moisture.

Special levelling board, special tamper, rake, gauges, spirit level, metal straight edge, wheel chocks.

MEHABIT, MEHAPOR and MEHASPORT can be installed under wet and mastic asphalt screeds as well as under dry subfloors (floor installation boards, such as chipboard or OSB boards or cement fibre boards). Install the MEHA fills on dry ground only. Ensure that adequate protection from moisture is provided.

Waterproofing against ground moisture and non-pressurised water must be specified by the architect and put in place before the screed is installed. For structural elements in contact with soil (e.g. ground slabs), configure the waterproofing in accordance with DIN.

If necessary, the insulation and compensation layer must be protected against moisture by suitable measures (e.g. vapour barriers). A polyethylene film (PE film) must be placed underneath the insulation and levelling layer as protection against rising residual moisture from unfinished floors (e.g. concrete false ceilings). As a rule, no vapour barrier may be used within wooden beam ceilings to avoid possible condensation damage.

As a matter of principle, MEHA‘s fills should only be installed after window, heating and plastering work has been completed and the rooms have dried out.

When ordering the bulk material, take into account the necessary overspill of 10-12 % and any floor unevenness.

For larger joints in wooden substrates, through which the material could trickle away, a diffusion-open trickle protection (e.g. MEHAFIPP) must be laid (no foil, otherwise there is a risk of condensation water damage!)

After stripping and compacting, and before applying the covering, the fill should be checked for evenness by means of a straight edge and spirit level. Unevenness is to be levelled out, edge zones may have to be re-spread.

When the fill is installed in areas where greater, and in particular dynamic loads are to be expected, sufficient pressure distribution must be provided (by means of load distribution plate) to ensure that the installed fill is compressed evenly.

Chip/OSB boards with tongue and groove are to be installed in a thickness of 18/19 mm, ideally 22 mm, staggered and glued all round; for pouring heights from 100 mm in 25 mm thickness or double-layer (staggered).

Even in the case of cement-fibre boards with a step fold, the fill must be covered with a load distribution plate. Otherwise, the installation guidelines of the individual manufacturers must be observed. The same applies to standards and recognised rules of technology.